// material
Substrate
封裝測試-材料
- Substrate
- Epoxy(DBP)
- Molding Compound
- Film(DAF/ FOW)
- Polyimide
- Bumping Chemical
- Pogo Pin
- Carrier/ Boat
- Backside Protection Film
- Warpage Control Film
// material
Epoxy(DBP)
// material
Molding Compound
// material
Film(DAF/ FOW)
// material
Polyimide
// material
Bumping Chemical
// material
Pogo Pin
// material
Carrier/ Boat
// material
Backside Protection Film
// material
Warpage Control Film
