Equipment

Product Introduction:

Semiconductor assembling package's logo & code marking

Application:

Applying for marking process
Marking surface : Die/ Heat Sink/ Compound
Loader/ Unloader : Magazine/ Cassette/ Tray

Product Introduction:

Using microwave to clean critical point, such as slot between chip and substrate in flip chip package.

Application:

Plasma before Die Bond/ Wire bond/ Underfill

Product Introduction:

For automatic ball mount, the machine is able to apply to BGA & CSP package.

Application:

Consistently apply flux on substrate and place the solder ball on substrate

Product Introduction:

For package sawing, the machine can be deal with multi-works cutting by dual facing spindle along with optional usage of blades

Application:

The machine is applied for assembly package cutting

Product Introduction:

Laser ablation equipment is designed for Package on Package stacking process

Application:

By using laser to control ablation depth and hole diameter precisely while melting compound.

Product Introduction:

For flip chip product, the machine can be used to fill glue materials between die and substrate. Dual pump option is available for dispensing operation which is designed with Linear Motor to ensure high accuracy, speed and position.

Application:

This machine is applied for flip chip product

Product Introduction:

Equipment is designed for cutting multiple/ composite materials by UV Laser

Application:

Die & Compound cutting and forming

Product Introduction:

Marking on wafer type product

Application:

Wafer marking/ marking through blue tape, can apply on both 8" & 12" wafer

Loader/ Unloader : Metal Frame Cassette/ FOUP/ Open Cassette