Materials

Product Introduction:

Semiconductor IC carrier board for PBGA or CSP.

Application:

As key material of semiconductor assembling, substrate can provide electrical connection, protection, support, heat dissipation, assembly and other functions to achieve high pin (I/O) count, reduce the package size, improve electrical performance and heat dissipation, ultra-high density or multi-chip modularization.

Product Introduction:

Die attached material of semiconductor IC packaging at Die-Bond stage, including conductive type and non-conductive type.

Application:

Attached material between Substrate/ Lead frame and Die.

Product Introduction:

Key material to protect semiconductor chips from adverse temperature, humidity, foreign matter, physical shock and increase reliability. To fulfill different requirements of designs and structures, compound also has different types, such as Tablet and Powder (Granule).

Application:

IC & Diode packaging

Product Introduction:

DAF is laminated to wafer after grinding, then die bonding after dicing. Film type attached material mainly support for package with thinner die structure, with its better flatness performance. There are UV & Non-UV type, depend on process requirement.

Major size of DAF/FOW are 8 inches and 12 inches.

Application:

Attached material between Substrate/ Lead frame and Die.

Production:

Plating solution for Sn and Ag

Application:

Apply on Ag/ Sn plating alloy

Production:

Etchant chemical for Cu/ Ti

Application:

Low operating temperature and long life time for Cu/ Ti etching, the chemical can be applied with control on side etching and volume amount accurately, even on the finer pitch patterns to assure no Ti residual on PI surface

Production:

Stripper

Application:

Resist stripper for positive photoresist which can be applied to various wiring materials.

Product Introduction:

Pogo pin is made by 4 different parts：top plunger, bottom plunger, spring and barrel ; and apply with precision machined caulking process. The top plunger is often applied with Au plating to optimize pin performance and we can provide customized crown design.

Application:

We can design products with requested material for multifunction pogo pins

Product Introduction:

Flip Chip Carrier Fixture.

Application:

The product is used in Flip Chip for FCCSP/FCBGA.

Product Introduction:

Ultrafiltration Hollow Tube Membrane development and manufacture.

Application:

1. Membrane Bioreactor System application
2. Membrane Chemical Reactor application
3. Emulsified Water Wastewater Treatment

Product Introduction:

1. Application for WLCSP & Fan-Out process, can reduce the defects caused by cutting the wafer.
2. Application for Infrared (IR) Transmission inspection of wafer backside.

Application:

Product Introduction:

1. Over 300℃
2. Can control any wafer warpage for RDL process.

Application:

Product Introduction:

Offering comprehensive solutions encompassing a wide array of metallic and non-metallic materials, catering to both soft and hard materials for various processing needs. Our capabilities span Turning, Milling, Centerless Grinding, Surface Grinding, lathe tool post grinding, and surface handling.

Specializing in precision parts manufacturing for CNC lathes and CNC milling machines, we ensure high-quality production and efficient service delivery.

Application:

Focusing on the development, design, and manufacturing of precision automated machinery, fixtures, and parts for the semiconductor and optoelectronic industries.